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semiconductor package
A semiconductor package is a metal, plastic, glass or ceramic casing containing one or more semiconductor electronic components. Individual discrete components are typically etched in silicon wafer before being cut and assembled in a package. The package provides protection against impact and corrosion, holds the contact pins or leads which are used to connect from external circuits to the device, and dissipates heat produced in the device.
Thousands of standard package types are made, with some made to industry-wide standards and some particular to an individual manufacturer.
==Package functions==
A semiconductor package may have as few as two leads or contacts for devices such as diodes, or in the case of advanced microprocessors, a package may have hundreds of connections. Very small packages may be supported only by their wire leads. Larger devices, intended for high-power applications, are installed in carefully designed heat sinks so that they can dissipate hundred or thousands of watts of waste heat.
In addition to providing connections to the semiconductor and handling waste heat, the semiconductor package must protect the "chip" from the environment, particularly the ingress of moisture. Stray particles or corrosion products inside the package may degrade performance of the device or cause failure.〔Lloyd P.Hunter (ed.), ''Handbook of Semiconductor Electronics'', McGraw Hill, 1956 ,Library of Congress catalog 56-6869, no ISBN chapter 9〕 A hermetic package allows essentially no gas exchange with the surroundings; such construction requires glass, ceramic or metal enclosures.
抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』
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